The ACM PECVD SiCN system is configured for 300-millimeter wafer processing, supports process temperatures up to 400 degrees Celsius (°C), and features four load ports and three process chambers to ...

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

The popularity of cloud computing and AI—driving massive data flows—pushes demand for ultra-high-speed, energy-efficient ...

At this time, I would like to welcome everyone to the KLA Corporation March Quarter 2026 Earnings Conference Call. [Operator Instructions] I will now turn the call over to Kevin Kessel, Vice President ...

OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group’s printed circuit ...

Detailed price information for BE Smcndctr Indus ADR (BESIY) from The Globe and Mail including charting and trades.

ASMPT Limited (ASMPT / the Group / the Company) (Stock code: 0522), a leading global provider of hardware and software ...

Since the start of 2026, sustained demand from AI and high-performance computing (HPC) has kept the global semiconductor equipment financing highly active. In China, under the push for supply chain ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of different materials, introducing process compatibility and thermal and ...

AI boom lifts both, but NVIDIA's data center dominance, strong growth and valuation edge make it the better investment now over Applied Materials.

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

In 2026, JCET has accelerated the commercialization of its R&D initiatives, scaled up advanced manufacturing capacity, and ...