System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

NEWARK, N.J.--(BUSINESS WIRE)--Panasonic System Communications Company of North America, a leading provider of business telephone systems, today announced the new KX-TGP600, a SIP cordless phone ...

The development of austriamicrosystems’ second-generation multimedia platform and its derivative products exemplifies the advantages that an SIP (system-in-package) product can offer over an SOC ...

The impatient and hungry mobile electronics market is fueling the need for system packaging technologies as an interim solution before the inevitable transition to system-on-chip methodologies. While ...

Small businesses flock to the cloud for a wide variety of their needs, including their voice communications. And as with any cloud-delivered service, hardware can often determine whether the ...

The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...